Automotive Grade Two-Component Silicone Potting Compound FD503-TG60S

Product Description

FD503-TG60S is an automotive-grade two-component addition-cure silicone potting compound engineered for under-hood electronic encapsulation. With a low mixed viscosity of 600-1200 cps, the material readily penetrates tight gaps and complex geometries, ensuring complete void-free encapsulation of densely packed PCB assemblies.

The product uses a 1:1 mix ratio for straightforward processing and cures to a Shore A hardness of 25-35, providing flexible protection against thermal cycling stress. It meets UL94 V-0 flame retardancy standards, critical for automotive safety compliance. The material offers stable performance across a wide temperature range of -40u00b0C to +200u00b0C, with volume resistivity of u22651.0u00d710u00b9u00b2 u03a9u00b7cm and dielectric strength of u226515 kV/mm. Specific gravity of 1.3u00b10.03 indicates a moderate filler loading balanced for flow and protection.

Key Applications

• Automotive ECUs and engine control modules
• Sensors and connectors in engine compartments
• Under-hood power distribution units
• Transmission control modules