Product Description
FD503-TG102 is a high thermal conductivity two-component addition-cure silicone potting compound engineered for power electronics requiring efficient heat dissipation. With thermal conductivity of u22651.5 W/mu00b7K, it provides enhanced thermal management compared to standard potting compounds, enabling higher power density designs.
The product features a 1:1 mix ratio with mixed viscosity of 4000-6000 cps, suitable for controlled dispensing applications. After curing, it achieves a Shore A hardness of 30-40, offering a balance of mechanical protection and thermal stress absorption. It meets UL94 V-0 flame retardancy standards, with volume resistivity of u22651.0u00d710u00b9u00b3 u03a9u00b7cm and dielectric strength of u226513 kV/mm. The material operates reliably from -40u00b0C to +200u00b0C. Specific gravity of 2.15u00b10.1 indicates significant thermal filler loading.
Key Applications
- Power modules and IGBT modules
- High-power LED drivers
- Telecom power supplies
- Industrial motor drives
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