Product Description
FD503-TG101 is a general-purpose two-component addition-cure silicone potting compound designed for broad electronic encapsulation applications. With a mixed viscosity of 2500u00b11000 cps at a 1:1 mix ratio, it provides versatile processability compatible with both manual and automated dispensing equipment.
The product cures to a Shore A hardness of 45-55, offering robust mechanical protection while maintaining sufficient flexibility to absorb thermal stresses. It meets UL94 V-0 flame retardancy standards, with volume resistivity of u22651.0u00d710u00b9u00b3 u03a9u00b7cm and dielectric strength of u226515 kV/mm. Operating across -40u00b0C to +200u00b0C, it is suitable for demanding industrial environments. Specific gravity of 1.72u00b10.05 reflects balanced formulation for general-purpose use.
Key Applications
- Consumer electronics power supplies
- Industrial control modules
- LED lighting drivers
- General-purpose sensor encapsulation
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