High Thermal Conductivity Two-Component Silicone Potting Compound FD503-TG201

Product Description

FD503-TG201 is a high thermal conductivity two-component addition-cure silicone potting compound delivering thermal conductivity of 2.0u00b10.2 W/mu00b7K. This enhanced thermal performance makes it ideal for applications where efficient heat transfer from encapsulated components is critical.

With a 1:1 mix ratio and mixed viscosity of 3000-5000 cps, it provides good processability for precision dispensing. The product cures to a soft Shore A hardness of 20-30, creating a low-stress encapsulation that protects delicate solder joints and wire bonds during thermal cycling. It meets UL94 V-0 flame retardancy, with volume resistivity of u22651.0u00d710u00b9u00b3 u03a9u00b7cm and dielectric strength of u226515 kV/mm. Operating range spans -40u00b0C to +200u00b0C. Specific gravity of 2.73u00b10.1 reflects a high thermal filler content optimized for heat transfer.

Key Applications

• EV battery pack gap filling
• Power converter modules
• Thermal interface applications
• High-density power supplies