High Thermal Conductivity Two-Component Silicone Potting Compound FD503-TG301

Product Description

FD503-TG301 is an ultra-high thermal conductivity two-component addition-cure silicone potting compound delivering 3.0 W/mu00b7K thermal conductivity. Engineered for the most demanding power electronics applications, it enables maximum heat dissipation in compact, high-power designs.

The product features a 1:1 mix ratio with higher mixed viscosity of 8000-15000 cps due to high thermal filler content, requiring controlled dispensing techniques. After curing, it achieves a Shore A hardness of 40-60, providing robust mechanical integrity for vibration-prone environments. It meets UL94 V-0 flame retardancy, with volume resistivity of u22651.0u00d710u00b9u00b3 u03a9u00b7cm and dielectric strength of u226515 kV/mm. Operating range spans -40u00b0C to +200u00b0C. Specific gravity of 3.0u00b10.1 is the highest in the FD503 series, indicative of dense thermal filler loading for maximum heat transfer.

Key Applications

• High-power EV inverters and traction motor controllers
• DC-DC converters for electric vehicles
• Industrial power supplies
• High-current rectifier modules