| Model | FD503-TG107 / TG301 / TG401 |
| Type | Two-Component Silicone Resin Potting Compound, High Thermal Conductivity |
| Appearance A | Light Yellow Liquid |
| Appearance B | White Viscous Liquid |
| Mix Ratio (A:B) | 1:1 |
| Mixed Viscosity | 8000-15000 cps |
| Thermal Conductivity | 3.0 W/m·K |
| Cure Time @120°C | 20 minutes |
| Hardness | 45-55 Shore A |
| Flame Rating | UL94 V-0 |
| Temperature Range | -50°C to +200°C |
| Applications | High-power electronics, EV battery modules, LED power supplies |
High thermal conductivity silicone resin potting compound designed for demanding heat dissipation applications. Thermal conductivity up to 3.0 W/m·K, UL94 V-0 flame retardant. Ideal for high-power electronics, EV battery modules, and LED power supplies.
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