High Thermal Conductivity Two-Component Silicone Potting Compound FD503-TG401

Product Description

FD503-TG401 is the flagship high thermal conductivity two-component silicone resin potting compound in the FD503 series, delivering thermal conductivity of 4.0u00b10.4 W/mu00b7K. This exceptional thermal performance surpasses conventional silicone potting materials, making it the optimal choice for cutting-edge power electronics applications.

With a 1:1 mix ratio and mixed viscosity of 10000-15000 cps, the high filler loading requires appropriate dispensing equipment. It cures to a very soft Shore A hardness of 10-20, providing excellent stress absorption for large-area encapsulation where thermal expansion mismatch is a concern. The material meets UL94 V-0 flame retardancy, with volume resistivity of u22651.0u00d710u00b9u00b2 u03a9u00b7cm and dielectric strength of u226510 kV/mm. Operating range spans -40u00b0C to +200u00b0C. Specific gravity of 3.25u00b10.2 is the highest in the series, representing the maximum thermal filler packing density.

Key Applications

• Next-generation EV power modules
• High-performance computing power delivery
• Renewable energy inverters
• Aerospace power electronics