Product Description
FD503-TG101-2 is a low specific gravity two-component addition-cure silicone potting compound developed for weight-sensitive electronic encapsulation applications. With a specific gravity of only 0.7u00b10.05, it delivers approximately 50% weight reduction compared to conventional potting materials while maintaining robust electrical insulation and mechanical protection.
The product features a 1:1 mix ratio and mixed viscosity of 1500-2500 cps, providing balanced flow characteristics suitable for both manual and automated dispensing. After curing, it achieves a hardness of 25-35 Shore A, offering a soft and flexible gel-like consistency that minimizes stress on delicate components. The material exhibits excellent dielectric strength (u226518 kV/mm) and high volume resistivity (u22651.0u00d710u00b9u00b3 u03a9u00b7cm), ensuring reliable electrical isolation. Operating across a temperature range of -40u00b0C to +200u00b0C, it performs reliably in harsh environments.
Key Applications
- Lightweight encapsulation for weight-sensitive electronics
- Aerospace components requiring mass reduction
- Portable electronic devices
- Drone and UAV electronics
Reviews
There are no reviews yet.